Wiliot Announce Initial Partners

Wiliot have announced their initial set of partners. Wiliot is a new Bluetooth beacon that looks like a wafer thin NFC sticker but actually uses (wireless) energy harvesting with a very low power System on a Chip (SoC). This brings down the size and cost to allow integration into manufactured goods.

The initial partners are symbiotic in that they will help provide for initial rollout. They include Avery Dennison for tag production, SATO for tag printing, Evrythng for a cloud backend, Aruba for integration into WiFi and Fanstel and Estimote for gateways.

Energy Harvesting for Beacons

Some of the latest innovations in beacons are related to how they are powered. When beacons can be self-powered it greatly reduces maintenance, improves convenience and removes wastage (of batteries).

As we have previously mentioned, Wiliot is pioneering the use of Radio Frequency (RF) energy harvesting. There’s a very recent Wiliot article Nano-Watt Computing that explains how Wiliot are harvesting RF energy in such as way as to charge a capacitor that, periodically charged, can be used to power a beacon.

RF isn’t the only way to charge a capacitor. Recent research from Japan on Ultra-low-power energy harvester for microbial fuel cells and its application to environmental sensing and long-range wireless data transmission shows how Microbial fuel cells (MFCs) can be used to power a Bluetooth beacon.

Microbial fuel cells (MFCs) generate electricity directly from organic matter contained in aquatic sediment, soil, and domestic wastewater. The research describes UPEM, the first harvester that takes real-time measurements of temperature and humidity, CO2 sensing and provides iBeacon and LoRa transmission using a single MFC.

New Wafer Thin Nordic nRF51 SoC

Nordic, the manufacturer of the System on a Chip (SoC) found in most beacons has announced that an ultra thin version will be available from American Semiconductor.

The AS_NRF51 Flex-BLE (pdf) is an ultra-thin version of Nordic’s nRF51822 SoC wafer-level CSP (WL-CSP), employing American Semiconductor’s ‘FleX™ Semiconductor-on-Polymer™’ (FleX SoP) process to reduce package size to approximately 35µm—roughly half the thickness of a human hair.

The largest component of beacons and Bluetooth sensors is usually the battery rather than the SoC. However, the Flex-BLE version will be especially suited to energy harvested and solar solutions where it will be possible to create very thin beacons that can be invisibly manufactured into products or their packaging.

Wiliot To Enable New Beacon Usecases

We mentioned Wiliot last March and since then their R&D team has created early engineering samples that prove it’s possible to create a battery-less Bluetooth LE beacon harvesting energy from radio frequencies (RF).

The Wiliot device looks more like a RFID tag than a traditional beacon in that it’s supplied as a very thin PVC inlay sheet containing the chip and wire antenna together. The thin form factor, no battery and the relatively low cost will allow it to be manufactured into or stuck onto clothing and packaging that will provide for many new usecases.

Producing such a device isn’t easy as it can’t use existing System On a Chip (SoC) devices as produced by Nordic, Dialog and Texas Instruments (TI) because they are too large and use too much power. Wiliot has had to create their own SoC from the ground up, including software tools to develop and program the devices. We have been told it will be a year before Wilot has all the components in place for commercial rollout. Meanwhile, selected organisations can join the Early Advantage Program (EAP). There’s a new a product overview (PDF below) that explains the EAP and the main usecases, connected packaging, connected apparel, logistics and asset tracking:

Wiliot already have Early Advantage Program (EAP) agreements in place with over a dozen brands including top fashion brands, a telco, appliance companies, a furniture brand and packaging companies.